1. Base material: FR-4/H-Tg FR-4/lead-free materials/CEM-3, aluminum, Rogers, ceramics 2. Copper thickness: 1-6oz 3. Board thickness: 0.2-8.5mm 4. Minimum hole size: 0.2mm 5. Minimum line width: 3 mil 6. Minimum line spacing: 3 mil 7. Surface finishing: HASL, ENIG, immersion silver, immersion tin 8. Outline: routing, V-groove, beveling punch 9. Solder mask colors: green, red, blue, black, white 10. Silkscreen colors: red, yellow, black, white 11. Hole position deviation: ±0.05mm (±2mil) 12. PTH diameter: ±0.076mm (±3mil) 13. NPTH diameter.: ±0.05mm (±2mil) 14. Minimum S/M pitch: 0.1mm (4mil) 15. Outline tolerance: ±0.15mm 16. Heavy copper: 4oz - 8oz 17. Peelable mask: top, bottom, double sided